Stone plating / copper plating

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Stone plating / copper plating


A surface treatment company specializing in gold plating and electroless nickel (Ni-P)

Stone plating / copper plating
  • Neutral stone plating: Since it does not use halogen compounds, corrosion of the chip is insignificant, and the plating particles are dense. In addition, it has excellent solderability and adhesion, and has strong corrosion resistance, so it is less oxidized by oxygen even when exposed to air for a long time.

Applications: Semiconductor packaging and lead frame, battery terminal, communication connector, general terminals, etc.
Process diagram

Sn plating process diagram

Surface adjustment
Electrolytic nickel
Stone plating
Discoloration prevention
Dehydration and drying
Inspection and shipment


Contact Us

Tel. 1234-1234

평일 09:00 - 18:00 (주말/공휴일 휴무)

  • Address : 335-8, Haean-ro, Danwon-gu, Ansan-si, Gyeonggi-do (652-8, Choji-dong)
  • Tel :+82-31-434-3663   |   E-mail :
  • Copyright ⓒJeong woo EZTEC Co., Ltd. All rights reserved.